- Product
- Wire-to-Board Connector
- Pitch 3.0mm Wafer
Product Details
Pitch 3.0mm Wafer, 180°, DIP
Product Introduction
Material:
1. Housing: Nylon-66, UL94V-2.
2. Terminal: Copper alloy. Tin-plated.
Electrical:
1. Current rating: 5A AC.DC.
2. Voltage rating: 250V AC,DC.
3. Contact resistance: 10m ohms Max
4. Insulator resistance: 1000M ohms Min.
5. Dielectric withstanding: 800V AC/Min.
6. Temperature: -25°C ~ +105°C.
Available pins: 02, 04, 06, ....24 contacts.